High-Density Package Substrate Using Organic Interposer
- Resource Type
- Journal
- Language
- Japanese
- Region
- Japan
- Price
- $68.00
- Article Title
- High-Density Package Substrate Using Organic Interposer
- Publication
- Journal of The Japan Institute of Electronics Packaging
- ISSN
- 1343-9677
- Volume
- 26
- Issue
- 4
- Year
- 2023
- Pages
- 361-366
- Data Format
- Subject Fields
- Material Science
- Note
- Full text is usually delivered within 1-2 hours
